Elsevier

Selected Papers from the 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2026)

Current call from Microelectronics Reliability on “Selected Papers from the 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2026)”. Review the official call for detailed scope, research themes and submission requirements.

Journal: Microelectronics Reliability Deadline: 2027-01-31 Discipline: Other Guest editor(s): Jiajie Fan, Przemyslaw Jakub Gromala, Alberto Corigliano, Cadmus Yuan Topics: Selected, International, Conference

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Selected Papers from the 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2026)

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