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Elsevier

Advanced Thermal Management Technologies for High-Density Data Centers: From Chip to Facility

Current call from International Journal of Heat and Mass Transfer on “Advanced Thermal Management Technologies for High-Density Data Centers: From Chip to Facility”. Review the official call for detailed scope, research themes and submission requirements.

Journal: International Journal of Heat and Mass Transfer Deadline: 2026-11-01 Discipline: Business & Management Guest editor(s): Nenad Miljkovic, Vishwanath Ganesan, Naimish Pandya Topics: Advanced, Thermal, Management
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