Elsevier

Advanced Electronic Packaging and Heterogenous Integration for Future Artificial Intelligence Applications

Current call from Materials Science in Semiconductor Processing on “Advanced Electronic Packaging and Heterogenous Integration for Future Artificial Intelligence Applications”. Review the official call for detailed scope, research themes and submission requirements.

Journal: Materials Science in Semiconductor Processing Deadline: 2026-11-01 Discipline: Engineering Guest editor(s): Chong Leong Gan, Min-Hua Chung, Chen-Yu Huang, Hong Wan Ng, Kuan-Neng Chen Topics: Advanced, Electronic, Packaging

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Advanced Electronic Packaging and Heterogenous Integration for Future Artificial Intelligence Applications

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